Details
| Originalsprache | Englisch |
|---|---|
| Fachzeitschrift | Advanced engineering materials |
| Publikationsstatus | Elektronisch veröffentlicht (E-Pub) - 23 Feb. 2026 |
Abstract
This work addresses a central challenge in Al–Cu compound casting: native copper oxides, which inhibit wetting and metallurgical bonding. A laser-based deoxidation strategy (ns-pulsed, 1064 nm) performed under oxygen-free, XHV-equivalent glovebox conditions, and quantifying subsequent oxide regrowth during realistic short-term handling, is demonstrated. Surface roughness was tuned via pulse/line overlap (0% vs. 70%) and characterized using confocal microscopy and power spectral density analysis. X-ray photoelectron spectroscopy reveals that laser processing under XHV-equivalent conditions produces copper surfaces that are more than 98% oxide-free and remain predominantly metallic for at least 720 h, whereas exposure to ambient air rapidly leads to the formation of a Cu2O/Cu(OH)2 surface layer within 24 h. Subsequent post-treatment heating promotes the transformation Cu (Formula presented.) O (Formula presented.) CuO, in accordance with established low-temperature oxidation pathways. Casting under XHV-equivalent conditions yields fully bonded Al–Cu interfaces with the expected Al2Cu, AlCu, and Al4Cu9 intermetallic layers. Intermetallic compound (IMC) morphology is more strongly governed by processing parameters (temperature, expected melt-to-solid ratio, and thermal history) than by minor short-term oxide regrowth. Overall, laser deoxidation under XHV-equivalent conditions emerges as a pretreatment that improves wetting, enables controllable IMC formation, and preserves high interfacial thermal conductivity in Al–Cu composite castings.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Allgemeine Materialwissenschaften
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
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in: Advanced engineering materials, 23.02.2026.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Al–Cu Composite Casting of Laser-Deoxidized Copper
T2 - Bonding, Interfacial Chemistry, and Thermal Conductivity
AU - Steinhoff, Timon
AU - Janthur, Finn Lennard
AU - Zimmermann, Sascha
AU - Seffer, Sarah
AU - Hermsdorf, Jörg
AU - Gustus, René
AU - Overmeyer, Ludger
AU - Maus-Friedrichs, Wolfgang
AU - Maier, Hans Jürgen
AU - Klose, Christian
N1 - Publisher Copyright: © 2026 The Author(s). Advanced Engineering Materials published by Wiley-VCH GmbH.
PY - 2026/2/23
Y1 - 2026/2/23
N2 - This work addresses a central challenge in Al–Cu compound casting: native copper oxides, which inhibit wetting and metallurgical bonding. A laser-based deoxidation strategy (ns-pulsed, 1064 nm) performed under oxygen-free, XHV-equivalent glovebox conditions, and quantifying subsequent oxide regrowth during realistic short-term handling, is demonstrated. Surface roughness was tuned via pulse/line overlap (0% vs. 70%) and characterized using confocal microscopy and power spectral density analysis. X-ray photoelectron spectroscopy reveals that laser processing under XHV-equivalent conditions produces copper surfaces that are more than 98% oxide-free and remain predominantly metallic for at least 720 h, whereas exposure to ambient air rapidly leads to the formation of a Cu2O/Cu(OH)2 surface layer within 24 h. Subsequent post-treatment heating promotes the transformation Cu (Formula presented.) O (Formula presented.) CuO, in accordance with established low-temperature oxidation pathways. Casting under XHV-equivalent conditions yields fully bonded Al–Cu interfaces with the expected Al2Cu, AlCu, and Al4Cu9 intermetallic layers. Intermetallic compound (IMC) morphology is more strongly governed by processing parameters (temperature, expected melt-to-solid ratio, and thermal history) than by minor short-term oxide regrowth. Overall, laser deoxidation under XHV-equivalent conditions emerges as a pretreatment that improves wetting, enables controllable IMC formation, and preserves high interfacial thermal conductivity in Al–Cu composite castings.
AB - This work addresses a central challenge in Al–Cu compound casting: native copper oxides, which inhibit wetting and metallurgical bonding. A laser-based deoxidation strategy (ns-pulsed, 1064 nm) performed under oxygen-free, XHV-equivalent glovebox conditions, and quantifying subsequent oxide regrowth during realistic short-term handling, is demonstrated. Surface roughness was tuned via pulse/line overlap (0% vs. 70%) and characterized using confocal microscopy and power spectral density analysis. X-ray photoelectron spectroscopy reveals that laser processing under XHV-equivalent conditions produces copper surfaces that are more than 98% oxide-free and remain predominantly metallic for at least 720 h, whereas exposure to ambient air rapidly leads to the formation of a Cu2O/Cu(OH)2 surface layer within 24 h. Subsequent post-treatment heating promotes the transformation Cu (Formula presented.) O (Formula presented.) CuO, in accordance with established low-temperature oxidation pathways. Casting under XHV-equivalent conditions yields fully bonded Al–Cu interfaces with the expected Al2Cu, AlCu, and Al4Cu9 intermetallic layers. Intermetallic compound (IMC) morphology is more strongly governed by processing parameters (temperature, expected melt-to-solid ratio, and thermal history) than by minor short-term oxide regrowth. Overall, laser deoxidation under XHV-equivalent conditions emerges as a pretreatment that improves wetting, enables controllable IMC formation, and preserves high interfacial thermal conductivity in Al–Cu composite castings.
KW - Al–Cu
KW - compound casting
KW - copper oxidation kinetics
KW - intermetallic compounds
KW - laser deoxidation
UR - http://www.scopus.com/inward/record.url?scp=105030556163&partnerID=8YFLogxK
U2 - 10.1002/adem.202502800
DO - 10.1002/adem.202502800
M3 - Article
AN - SCOPUS:105030556163
JO - Advanced engineering materials
JF - Advanced engineering materials
SN - 1438-1656
ER -