3D-Opto-MID for Asymmetric Optical Bus Couplers

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • Lukas Lorenz
  • Florian Hanesch
  • Krzysztof Nieweglowski
  • Yannic Eiche
  • Jorg Franke
  • Gerd Albert Hoffmann
  • Ludger Overmeyer
  • Karlheinz Bock

Externe Organisationen

  • Technische Universität Dresden
  • Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU Erlangen-Nürnberg)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des Sammelwerks2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
ISBN (elektronisch)978-1-7281-6293-5
ISBN (Print)978-1-7281-6294-2
PublikationsstatusVeröffentlicht - 2020
Veranstaltung8th IEEE Electronics System-Integration Technology Conference, ESTC 2020 - Tonsberg, Vestfold, Norwegen
Dauer: 15 Sept. 202018 Sept. 2020

Abstract

The development of easy-to-use optical bus-systems without the need for waveguide interruption is one important step to establish optical interconnects in short- to midrange networks. The challenge from the packaging side of view is the three-dimensional integration of optical parts and waveguides to a novel kind of package, called 3D-Opto-MID. In this article, we present an approach for stereolithographic printed, three-dimensional polymer structures on ceramic thick-film substrates. Thus, we are able to combine the design freedom of 3D printing with the excellent RF- and heat-management properties of the thick-film technology, especially important for electro-optical (e/o) converters. On the three-dimensional structures, the waveguides for the bus-coupler are applied, while the ceramic holds the electro optical converters. Furthermore, the 3D printing allows for easily manufactured alignment- and fixing structures for the coupler with a high accuracy. The results section shows the analysis of the adhesion behavior of the printed polymer on the ceramic, as well as the obtainable tolerances with the printed alignment structures. The average accuracy of the alignment was measured with 31.1µm, which is sufficient for the used 200 µm multimode waveguides. Furthermore, we demonstrate the functionality of the optical path of the module assembly, as well as the coupling to a bus waveguide, which proves the success of the 3D-Opto-MID integration.

ASJC Scopus Sachgebiete

Zitieren

3D-Opto-MID for Asymmetric Optical Bus Couplers. / Lorenz, Lukas; Hanesch, Florian; Nieweglowski, Krzysztof et al.
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers Inc., 2020. 9229840.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Lorenz, L, Hanesch, F, Nieweglowski, K, Eiche, Y, Franke, J, Hoffmann, GA, Overmeyer, L & Bock, K 2020, 3D-Opto-MID for Asymmetric Optical Bus Couplers. in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)., 9229840, Institute of Electrical and Electronics Engineers Inc., 8th IEEE Electronics System-Integration Technology Conference, ESTC 2020, Tonsberg, Vestfold, Norwegen, 15 Sept. 2020. https://doi.org/10.1109/ESTC48849.2020.9229840
Lorenz, L., Hanesch, F., Nieweglowski, K., Eiche, Y., Franke, J., Hoffmann, G. A., Overmeyer, L., & Bock, K. (2020). 3D-Opto-MID for Asymmetric Optical Bus Couplers. In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Artikel 9229840 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC48849.2020.9229840
Lorenz L, Hanesch F, Nieweglowski K, Eiche Y, Franke J, Hoffmann GA et al. 3D-Opto-MID for Asymmetric Optical Bus Couplers. in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers Inc. 2020. 9229840 doi: 10.1109/ESTC48849.2020.9229840
Lorenz, Lukas ; Hanesch, Florian ; Nieweglowski, Krzysztof et al. / 3D-Opto-MID for Asymmetric Optical Bus Couplers. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers Inc., 2020.
Download
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title = "3D-Opto-MID for Asymmetric Optical Bus Couplers",
abstract = "The development of easy-to-use optical bus-systems without the need for waveguide interruption is one important step to establish optical interconnects in short- to midrange networks. The challenge from the packaging side of view is the three-dimensional integration of optical parts and waveguides to a novel kind of package, called 3D-Opto-MID. In this article, we present an approach for stereolithographic printed, three-dimensional polymer structures on ceramic thick-film substrates. Thus, we are able to combine the design freedom of 3D printing with the excellent RF- and heat-management properties of the thick-film technology, especially important for electro-optical (e/o) converters. On the three-dimensional structures, the waveguides for the bus-coupler are applied, while the ceramic holds the electro optical converters. Furthermore, the 3D printing allows for easily manufactured alignment- and fixing structures for the coupler with a high accuracy. The results section shows the analysis of the adhesion behavior of the printed polymer on the ceramic, as well as the obtainable tolerances with the printed alignment structures. The average accuracy of the alignment was measured with 31.1µm, which is sufficient for the used 200 µm multimode waveguides. Furthermore, we demonstrate the functionality of the optical path of the module assembly, as well as the coupling to a bus waveguide, which proves the success of the 3D-Opto-MID integration.",
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T1 - 3D-Opto-MID for Asymmetric Optical Bus Couplers

AU - Lorenz, Lukas

AU - Hanesch, Florian

AU - Nieweglowski, Krzysztof

AU - Eiche, Yannic

AU - Franke, Jorg

AU - Hoffmann, Gerd Albert

AU - Overmeyer, Ludger

AU - Bock, Karlheinz

N1 - Funding Information: ACKNOWLEDGEMENT The authors would like to thank the “Deutsche Forschungsgemeinschaft (DFG)” for funding the research group and therefore providing the opportunity of doing fundamental progress in this seminal field of technology. The authors are wholly responsible for this publication. This work was supported in the Research Group OPTAVER (BO 3438/4-1; AOBJ: 648318).

PY - 2020

Y1 - 2020

N2 - The development of easy-to-use optical bus-systems without the need for waveguide interruption is one important step to establish optical interconnects in short- to midrange networks. The challenge from the packaging side of view is the three-dimensional integration of optical parts and waveguides to a novel kind of package, called 3D-Opto-MID. In this article, we present an approach for stereolithographic printed, three-dimensional polymer structures on ceramic thick-film substrates. Thus, we are able to combine the design freedom of 3D printing with the excellent RF- and heat-management properties of the thick-film technology, especially important for electro-optical (e/o) converters. On the three-dimensional structures, the waveguides for the bus-coupler are applied, while the ceramic holds the electro optical converters. Furthermore, the 3D printing allows for easily manufactured alignment- and fixing structures for the coupler with a high accuracy. The results section shows the analysis of the adhesion behavior of the printed polymer on the ceramic, as well as the obtainable tolerances with the printed alignment structures. The average accuracy of the alignment was measured with 31.1µm, which is sufficient for the used 200 µm multimode waveguides. Furthermore, we demonstrate the functionality of the optical path of the module assembly, as well as the coupling to a bus waveguide, which proves the success of the 3D-Opto-MID integration.

AB - The development of easy-to-use optical bus-systems without the need for waveguide interruption is one important step to establish optical interconnects in short- to midrange networks. The challenge from the packaging side of view is the three-dimensional integration of optical parts and waveguides to a novel kind of package, called 3D-Opto-MID. In this article, we present an approach for stereolithographic printed, three-dimensional polymer structures on ceramic thick-film substrates. Thus, we are able to combine the design freedom of 3D printing with the excellent RF- and heat-management properties of the thick-film technology, especially important for electro-optical (e/o) converters. On the three-dimensional structures, the waveguides for the bus-coupler are applied, while the ceramic holds the electro optical converters. Furthermore, the 3D printing allows for easily manufactured alignment- and fixing structures for the coupler with a high accuracy. The results section shows the analysis of the adhesion behavior of the printed polymer on the ceramic, as well as the obtainable tolerances with the printed alignment structures. The average accuracy of the alignment was measured with 31.1µm, which is sufficient for the used 200 µm multimode waveguides. Furthermore, we demonstrate the functionality of the optical path of the module assembly, as well as the coupling to a bus waveguide, which proves the success of the 3D-Opto-MID integration.

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KW - Additive manufacturing

KW - Ceramic polymer hybrid package

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KW - Stereo lithography

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BT - 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 8th IEEE Electronics System-Integration Technology Conference, ESTC 2020

Y2 - 15 September 2020 through 18 September 2020

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