This set provides supplementary data for the following paper: This dataset contains calculated thermal resistance values (Rth) for various Thermal Interface Materials (TIMs) used in graphics card assemblies. Calculations are based on realistic geometries, power consumption values, and thermal conductivities typical for high-performance GPUs. The effects of a proposed metallurgical bonding layer formed via Al-Cu compound casting are also evaluated. Performance comparisons are made for different TIM configurations (thermal pastes, pads, solder, compound joints) across high-end and mid-range GPU models (e.g., NVIDIA RTX 4090 and 4070). Temperature reductions are quantified as a function of interface quality and thermal power dissipation.